N75G-M80 / N75A-M80 M.2 PCIe SSD│TEAMGROUP

Graphene- 8.3% cooling
Aluminum-23.8% cooling^[1][2]

N75A/N75G has passed our rigorous internal laboratory tests and burn-in test. The patented ultra-thin graphene heat sink features graphene material with excellent thermal conduction performance, delivering heat dissipation rates of up to 8.3%. The patented high-strength aluminum fin heat sink features a unique thermal diversion design, capable of effectively reducing the temperature by up to 23.8%.

Leading heat dissipation solution

In response to the development of 5G communication, the increasing demand for smart edge computing and high-speed operation during 24 hours non-stop. The rugged industrial SSD, N75A-M80 and N75G-M80, equipped with patented heat sinks. Can be used in a limited space environment and provide excellent cooling performance, overcoming the extreme environments.

Exclusive patented heat dissipation technology

SSD outstanding performance and high endurance are well supported by patented aluminum fin and graphene heat sinks.

Wide temperature - Industrial high specification and durable 3D TLC chip, overcome the extreme environments

2021 Computex d&i awards
2022 Taiwan Excellence Awards

Won the 2021 COMPUTEX d&i awards and 2022 Taiwan Excellence Awards, N75G-M80 is sole “industrial-grade”SSD product of the award-winning entries.

2022 Taiwan Excellence Awards

2021-10-29
COMPUTEX d&i awards 2021

2021-10-28

Product Specifications

Model	N75A-M80 / N75G-M80
Interface	PCIe 3.0 x4
Flash Type	3D TLC
Capacity	128GB / 256GB / 512GB^[3]
Sequential R/W	R/W: 3,500 / 2,100MB/s (Max.)^[4]
Voltage	DC 3.3V±5%
Dimension	N75G-M80 : 80.0(L) x 22.0(W) x 3.8(H) mm (with Graphene heat sink) N75A-M80 : 80.0(L) x 23.4(W) x 12.9(H) mm (with Aluminum heat sink)
Shock	Operation: 50G / 11ms (compliant with MIL-STD-202G Test condition A) Non-operation: 1,500G / 0.5ms (compliant with MIL-STD-883K Test condition B)
Vibration	Operation: 7.69 Grms, 20~2,000 Hz / random (compliant with MIL-STD-810G General) Non-operation: 4.02 Grms, 15 ~ 2,000 Hz / sine (compliant with MIL-STD-810G General)
MTBF	> 3 million hours
Storage Temperature	-55°C (-67°F) ~ 95°C (203°F)
Operation Temperature	-40°C (-40°F) ~ 85°C (185°F)
Humidity	5% ~ 95%
Energy Consumption (Operation)	4.27W(512GB Max)
Energy Consumption (Non-operation)	0.82W(512GB Max)
P/E Cycle	3K
Thermal Sensor	√
External DRAM Buffer	√
TRIM	√
S.M.A.R.T.	√
Warranty	3-year limited warranty

PRECAUTIONS
[1] Initial read/write stages, temperature continuous raising. The N75A-M80 is equipped with TEAMGROUP's patented aluminum fin heat sink which delivers better cooling with natural convection or strong air cooling (e.g., fans), and the N75G-M80 equipped with patented graphene heat sink to achieve thermal conduction . The SSD has endured rigorous testing in closed spaces and burn-in tests. Results showed that the heat sinks support stable performance and extended SSD life.
[2] SSD performance is affected by controller temperature, the data is derived from TEAMGROUP lab testing and was calculated by comparing the controller temperatures from an M.2 PCIe Gen3*4 SSD w/o cooling fin against this product. TEAMGROUP adopted a simulation approach for creating the testing environment by using a mask and no fans. The actual speeds may vary depending on the platform's hardware and software.
[3] 1GB=1,000,000,000 Bytes. The operating system will show 1,000,000,000 Bytes/1024/1024/1024=0.93GB.
[4] This product is compatible with Intel and AMD platforms, and the performance result is tested on a motherboard that supports PCIe 3.0 interface by the internal laboratory. The actual speed may vary depending on the software and hardware conditions of the platform.

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