2400, 2133, 1866, 1600
For TEAM DARK family, TEAMGROUP Inc. selects high-quality ICs with strict test verification procedures to guarantee quality strictly. High capacity memory module design satisfies the requirement of 3D drawing multimedia workers, such that the operation is smooth and rapid when plenty of applications and media files are opened to meet the requirement of over-clocking users for various multimedia and gaming applications. Standard height multi-color heat sink is utilized for TEAM DARK to be compliant with heights of commercially available CPU heat sinks to the extreme extent. With additional mount of the latest V1.3 Intel XMP, the product provides better support and is the best selection for professional users requiring extreme performance.
| Product Dimensions | 133.5mm(L)x40.4mm(W)x6.45mm(H) |
| CAS Latency |
DDR3 1600: CL10-10-10-27 (8GB*1, 8GB*2 / 1.50V) CL9-9-9-24 (4GB*1, 4GB*2, 8GB*1, 8GB*2 / 1.50V) DDR3 1866: CL10-11-10-30 (8GB*2 / 1.50V) CL11-11-11-28 (4GB*2 / 1.50V) DDR3 2133: CL10-12-12-31 (4GB*2 / 8GB*2 / 1.65V) DDR3 2400: CL11-13-13-35 (4GB*2 / 8GB*2 / 1.65V) |
| DRAM Density | 256x8 / 512x8 |
| DataTransfer Bandwidth |
DDR3-1600（PC3-12800） DDR3-1866（PC3-14900） DDR3-2133（PC3-17000） DDR3-2400（PC3-19200） |
| Heat Sink | Aluminum heat-sink |
| Tested Voltage | 1.50V / 1.65V |
| Warranty | Lifetime warranty |
